With the tip still in the solder, put the sucker’s tip in the solder and fire the sucker’s release mechanism. If all of solder doesn’t come out, put more solder on and try again. Even if there is a little remnant solder left on the part after this procedure, you might be able to get the part out by heating each pin in turns and wiggling the part at the same time. Never force the part to move at the risk of damaging the pad on the circuit board.
 Before you start soldering a part back on the board you just removed a part from, use some solder wick to clean up the pad. Lay the wick across the pad and starting at the end you are holding in your hand, draw the soldering iron tip across the top of the wick slowly. Lift the wick up and off of the board just after the tip passes across it. If you let the wick cool against the pad, it will become stuck to the board and any pressure you apply will lift the pad from the board and damage the board. Always use a new clean length of wick to de-solder with, as used wick will not draw solder. Leave the wick on its spool while you use it. It makes it easier to work with, especially since it gets hot.

Written by: John Schrampfer a.k.a. Lectrical N Gineer